It is a great honor and pleasure for us to invite you to attend the 2027 International Conference on Materials AI Discovery (MAID 2027), which is organized by the PolyU-SCUT Centre for Advanced and Green Composite Materials, The Hong Kong Polytechnic University and co-organized by the Hong Kong Society of Mechanical Engineers (HKSME). The conference will be held in Hong Kong, China from August 13 to 15, 2027.

With the theme of "AI-Driven Discovery of Novel Materials and Chemical Space Exploration", MAID 2027 will serve as an international forum for presenting and exchanging technological advances and research results in the broad fields of AI-driven materials discovery, computational materials science, and intelligent manufacturing. It aims to bring together leading researchers, engineers, and scientists from around the world to share the latest research findings and engineering practices. We warmly invite prospective authors and participants to join MAID 2027 and contribute to the advancement of AI-driven materials discovery and chemical space exploration.

MAID 2027 is scheduled to include high-quality paper presentation sessions revealing the latest research findings, and to engage participants in interesting discussion sessions. Topics of interest for submission include, but are not limited to:

Authors must adhere to the conference written paper format. Please choose from the templates listed as follow based on your own request:

All papers will be peer reviewed, and each paper will be reviewed by 2–3 experts. It takes 20–30 days for the result to be released. If the paper needs revision, it should be resubmitted for peer review again. Submitted papers are evaluated using a double-blind review process for originality, relevance, and presentation. Reviewers for a paper will be kept anonymous.

• Manuscripts must be written in English;
• The manuscript should be written in accordance with the standard template;
• The topics of the paper should be relevant to the conference topics;
• Plagiarism and duplicate submissions are prohibited;
• Innovation and scientific value is a must.

Authors can submit manuscripts through the CMT electronic submission system. Please click the following link:

Electronic Submission System →

🔔 The submission system will be open on Oct. 30, 2026.

Download PDF Guide

First-time users should register an account first, then upload their paper to the system. Previous users can log in to the CMT system directly. If your paper needs to be updated after you receive the submission confirmation, please send the updated paper to the conference email maid@smehk.org directly; please do not update it in the Electronic Submission System.